Materials Tech Day


Digital Materials Tech Day I 26th of October

Hexagon office
46444 Hexagon Way
Novi, Michigan 48377

Join us on the 26th October for an in-person event that showcases the best and latest of our customers achievements, enabled with digital materials.

The different presentations cover the breadth of digital materials solutions across material data management, the design of lightweight components through multiscale simulations, the reduction of waste material with virtual tests, and many more!

The celebration of this 20th year anniversary of Digimat is part of our journey in the transition towards a more sustainable future, leveraging machine learning and cloud with expertise in materials modelling to shape the next generation of materials.

The day at a glance:

  • Materials Data Management
  • Multiscale simulations
  • Performance analysis
  • Digital material laboratory
  • Optimize manufacturing through simulation


  • 08:30-09:00 – Registration & Welcome
  • 09:00-09:15 – Hexagon – Introduction to Hexagon Solutions, by Michael Laperre, Sales Director at Hexagon
  • 09:15-09:45 – Hexagon – Productivity & Innovation: Empowering the Automotive Industry with Digital Material Solutions,Guillaume Boisot, Senior Director, Materials & Horizontal Technologies
  • 09:45-10:00 – Hexagon – Releases Highlights by Dustin Souza, Business Enablement Lead for Automotive at Hexagon
  • 10:00-10:30 – Coffee Break
  • 10:30-11:00 – General Motors – Fatigue Methodology for Polymeric Materials, by Satvir Aashat, CAE Material Technical Specialist – Composites & Thermoplastic Materials at General Motors & Dustin Souza, Business Enablement Lead for Automotive at Hexagon
  • 11:00-11:30 – Avient Corporation – Prediction of Automotive Long Fiber Composite Part Performance Utilizing FEA with Nonlinear Anisotropic Digimat Materials Models & Moldflow Injection Molding Fiber Orientations by Zachary Alderman, Design Engineer & Mike Dillman, Senior Design Engineer at Avient Corporation
  • 11:30-12:00 – Sumika Polymer Compounds – THERMOFIL® family - Developing Reinforced Polypropylene Compounds with a Reduced Carbon Footprint without Compromising Performance by Nicolas Schluting, Technical Manager at Sumika Polymer Compounds
  • 12:00-13:00 – Lunch & Networking
  • 13:00-13:30 – SLB – Development of a Custom Parametric Material Library with MaterialCenter by Chris del Campo, Principal Mechanical Engineer at SLB
  • 13:30-14:00 – Hexagon – Latest Improvements in MSC Nastran by Vicky Tsianika, Product Manager at Hexagon
  • 14:00-14:30 – Celanese – Use of Digimat in NVH & Thermal Shock Simulations 
  • 14:30-15:00 – Coffee Break
  • 15:00-15:30 – Moldex3D – Optimizing EV Structural Design with Simulations by Srikar Vallury, Engineering Manager at Moldex3D
  • 15:30-16:30 – Workshop – How to optimize EV component geometries for reduced weight & increased range by Gourab Ghosh, Technical Specialist at Hexagon
  • 16:30-17:00 – Workshop – How to utilize machine learning to enrich, and expand, existing material data by Dustin Souza, Business Enablement Lead for Automotive at Hexagon
  • 17:00-17:30 – Conclusion & Conference Wrap-Up
  • 17:30-23:00 – Social Event

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