Mastering Conceptual Level PCB Thermal Management in Electronics
Date: 20th July 2023, 15:30 - 16:30 IST
Mastering Conceptual Level PCB Thermal Management in Electronics
The goal of conceptual level thermal management is to establish a framework and guidelines for managing heat within the PCB design, which can then be further refined and implemented during the detailed design and engineering phases. It involves making informed decisions regarding component selection, thermal paths, thermal vias, PCB layer stack-up, and overall system architecture to optimize heat dissipation and prevent thermal-related issues.
By addressing thermal management at the conceptual level, designers can proactively identify potential thermal challenges, optimize the design layout, and select appropriate cooling techniques. This approach helps prevent issues such as component overheating, temperature differentials, hotspots, and thermal-induced performance degradation or failure.
As a cutting-edge solution for thermal simulation, PICLS of CRADLE CFD revolutionizes the conceptual level thermal management process for designers. This user-friendly tool empowers both experts and those new to thermal simulations to achieve accurate results effortlessly. With its real-time analysis capabilities and affordability, PICLS becomes an indispensable asset for designers and electronics professionals seeking to enhance their thermal management practices.
In this webinar, you will learn about how PICLS of CRADLE CFD can help master conceptual level PCB thermal management. This webinar is a must-attend for PCB designers, electronics engineers, and CFD engineers seeking to excel in thermal management practices. It also caters to individuals with a keen interest in thermal-fluid sciences and electronics
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